0545
参数
    Layers:4
    Material ：TU768+ThinFlex
    Thicknes:  1.6mm
    Copper thicknes 1OZ
    Surface Treatment:   ENIG+Hard gold 50U"
    Min. Hole Size: 0.2mm
    Width/Space:  0.1mm/0.1mm
工艺
  • Rigid-Flex board
应用
  • Telecommunication
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