0531
参数
    Layers: 8
    Material:DuPont PI+FR4
    Thicknes: 1.6mm
    Copper thicknes 1OZ
    Surface Treatment:  ENIG
    Min. Hole Size: 0.2mm
    Width/Space:  0.1mm/0.1mm
工艺
  • Rigid-Flex board
应用
  • Telecommunication
TOP
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