0559
参数
    Layers: 38
    Material: TU768
    Thickness: 5.0+/-0.45mm
    Copper thicknes: 1OZ
    Surface Treatment: ENIG
    Min. Hole Size: 0.45mm
工艺
  • Backplane Board + High layer-count, Back drill
应用
  • Telecommunication
TOP
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